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| Source: | Find a Tender Service (FTS) |
| Buyer: | University of Strathclyde |
| Main Category: | Goods |
| Procurement Method: | Open procedure |
| Tender Status: | Complete |
| Estimated Value (ex. VAT): | £1,900,000 |
| Release Date: | 20 December 2023 |
| Application Deadline: | 5 February 2024 |
| Procurement ID (OCID): | ocds-h6vhtk-03f66f |
| Notice Reference: | 037383-2023 |
NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The initial focus will be procuring equipment to support die bonding, wire bonding and encapsulation and associated ancillaries required.
Document pack· 1 file
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Pipeline status
Not addedContract imported automatically · AI writes the response
Application Deadline
5 February 2024
Closed
Estimated Value
£1,900,000
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