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| Source: | Find a Tender Service (FTS) |
| Notice Type: | Pipeline / planning |
| Buyer: | University of Strathclyde |
| Main Category: | Goods |
| Procurement Method: | — |
| Tender Status: | Planned |
| Estimated Value (ex. VAT): | £485,000 |
| Release Date: | 8 September 2023 |
| Application Deadline: | — |
| Procurement ID (OCID): | ocds-h6vhtk-03fb6b |
| Notice Reference: | 026705-2023 |
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NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The initial focus will be procuring equipment to support a laser based lidding and sealing capability along with any and all associated ancillaries required.
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Not addedContract imported automatically · AI writes the response
Estimated Value
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