Sub-Micron Die Bonder
| Source: | Find a Tender Service (FTS) |
| Buyer: | UNIVERSITY OF SHEFFIELD |
| Main Category: | Goods |
| Procurement Method: | — |
| Tender Status: | Planning |
| Estimated Value (ex. VAT): | £380,000 |
| Estimated Value (inc. VAT): | £380,000 |
| Release Date: | 9 December 2025 |
| Application Deadline: | — |
| Contract Start Date: | 2 March 2026 (Estimated) |
| Contract End Date: | 31 March 2026 (Estimated) |
| Contract Duration: | 1 month |
| Procurement ID (OCID): | ocds-h6vhtk-05f213🔒 BidWriter |
| Notice Reference: | 081169-2025🔒 BidWriter |
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Description
We are seeking equipment that can provide a wide range of bonding technologies to cater for semiconductor die to wafer, die to chip, wafer to wafer, fli-chip and other semiconductor chiplet bonding, to support our work in Heterogeneous Integration for Microelectronics and Semiconductor Systems.
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Estimated Value
£380,000
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