Loading page content…
Loading page content…
| Source: | Find a Tender Service (FTS) |
| Notice Type: | Award notice |
| Buyer: | University of Strathclyde |
| Main Category: | Goods |
| Procurement Method: | Open procedure |
| Tender Status: | Complete |
| Estimated Value (ex. VAT): | Not specified |
| Release Date: |
NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The initial focus will be procuring equipment to support die bonding, wire bonding and encapsulation and associated ancillaries required.
Published contracts in the last 12 months
84
total contracts
£19.8m
total value
£566,900
average contract size
Typical categories
Mechanical & Public Health Framework (MPHF) (2026-30)
University of Strathclyde · WAC-583377
Supply & Delivery of Grounds Maintenance / Landscaping Materials & Associated Products (2026-30)
University of Strathclyde · WAC-578632
Provision of Researcher Development Programme - 5 Lots
University of Strathclyde · WAC-576760
Pipeline status
Not addedContract imported automatically · AI writes the response
Need help writing this bid?
Our specialists write winning tender responses. Free consultation, no obligation.
Book a free consultation →| 3 July 2024 |
| Application Deadline: | — |
| Procurement ID (OCID): | ocds-h6vhtk-03f66f |
| Notice Reference: | 020273-2024 |